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2PD602AQL; 2PD602ARL; 2PD602ASL
50 V, 500 mA NPN general-purpose transistors
Rev. 01 -- 27 October 2008 Product data sheet
1. Product profile
1.1 General description
NPN general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
Table 1. Product overview Package NXP 2PD602AQL 2PD602ARL 2PD602ASL 2PD602AQL/DG 2PD602ARL/DG 2PD602ASL/DG
[1] /DG: halogen-free
Type number[1]
PNP complement JEDEC TO-236AB 2PB710ARL 2PB710ASL
SOT23
SOT23
TO-236AB
2PB710ARL/DG 2PB710ASL/DG
1.2 Features
I I I I General-purpose transistors Three current gain selections AEC-Q101 qualified Small SMD plastic package
1.3 Applications
I General-purpose switching and amplification
1.4 Quick reference data
Table 2. Symbol VCEO IC Quick reference data Parameter collector-emitter voltage collector current Conditions open base Min Typ Max 50 500 Unit V mA
NXP Semiconductors
2PD602AxL
50 V, 500 mA NPN general-purpose transistors
Quick reference data ...continued Parameter DC current gain hFE group Q hFE group R hFE group S Conditions VCE = 10 V; IC = 150 mA
[1]
Table 2. Symbol hFE
Min
Typ
Max
Unit
85 120 170
-
170 240 340
[1]
Pulse test: tp 300 s; 0.02.
2. Pinning information
Table 3. Pin 1 2 3 Pinning Description base emitter collector
1 2 2
sym021
Simplified outline
3
Graphic symbol
3 1
3. Ordering information
Table 4. Ordering information Package Name 2PD602AQL 2PD602ARL 2PD602ASL 2PD602AQL/DG 2PD602ARL/DG 2PD602ASL/DG
[1] /DG: halogen-free
Type number[1]
Description plastic surface-mounted package; 3 leads
Version SOT23
-
-
plastic surface-mounted package; 3 leads
SOT23
4. Marking
Table 5. Marking codes Marking code[1] SH* SG* SF* Type number 2PD602AQL 2PD602ARL 2PD602ASL
2PD602AXL_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 27 October 2008
2 of 9
NXP Semiconductors
2PD602AxL
50 V, 500 mA NPN general-purpose transistors
Marking codes ...continued Marking code[1] SX* SW* SV*
Table 5.
Type number 2PD602AQL/DG 2PD602ARL/DG 2PD602ASL/DG
[1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IBM Ptot Tj Tamb Tstg
[1]
Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current peak base current total power dissipation junction temperature ambient temperature storage temperature
Conditions open emitter open base open collector single pulse; tp 1 ms single pulse; tp 1 ms Tamb 25 C
[1]
Min -55 -65
Max 60 50 5 500 1 200 250 150 +150 +150
Unit V V V mA A mA mW C C C
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
6. Thermal characteristics
Table 7. Symbol Rth(j-a)
[1]
Thermal characteristics Parameter Conditions
[1]
Min -
Typ -
Max 500
Unit K/W
thermal resistance from junction in free air to ambient
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2PD602AXL_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 27 October 2008
3 of 9
NXP Semiconductors
2PD602AxL
50 V, 500 mA NPN general-purpose transistors
7. Characteristics
Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO Parameter Conditions VCB = 60 V; IE = 0 A; Tj = 150 C IEBO hFE emitter-base cut-off current DC current gain hFE group Q hFE group R hFE group S VCEsat fT collector-emitter saturation voltage transition frequency VEB = 4 V; IC = 0 A VCE = 10 V; IC = 500 mA VCE = 10 V; IC = 150 mA VCE = 10 V; IC = 150 mA VCE = 10 V; IC = 150 mA IC = 300 mA; IB = 30 mA VCE = 10 V; IC = 50 mA; f = 100 MHz
[1]
Min 40 85 120 170 -
Typ -
Max 10 5 10 170 240 340 600
Unit nA A nA
collector-base cut-off current VCB = 60 V; IE = 0 A
[1]
[1]
[1]
[1]
mV
[1]
hFE group Q hFE group R hFE group S Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz
140 160 180 -
-
15
MHz MHz MHz pF
[1]
Pulse test: tp 300 s; 0.02.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
2PD602AXL_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 27 October 2008
4 of 9
NXP Semiconductors
2PD602AxL
50 V, 500 mA NPN general-purpose transistors
9. Package outline
3.0 2.8
3
1.1 0.9
0.45 0.15 2.5 1.4 2.1 1.2
1
2
1.9 Dimensions in mm
0.48 0.38
0.15 0.09 04-11-04
Fig 1.
Package outline SOT23 (TO-236AB)
10. Packing information
Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] 2PD602AQL 2PD602ARL 2PD602ASL 2PD602AQL/DG 2PD602ARL/DG 2PD602ASL/DG
[1] [2] For further information and the availability of packing methods, see Section 14. /DG: halogen-free
Package SOT23
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -215 10000 -235
SOT23
4 mm pitch, 8 mm tape and reel
-215
-235
2PD602AXL_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 27 October 2008
5 of 9
NXP Semiconductors
2PD602AxL
50 V, 500 mA NPN general-purpose transistors
11. Soldering
3.3 2.9 1.9
solder lands solder resist 3 1.7 2 solder paste 0.6 (3x) occupied area Dimensions in mm 0.5 (3x) 0.6 (3x) 1
sot023_fr
0.7 (3x)
Fig 2.
Reflow soldering footprint SOT23 (TO-236AB)
2.2 1.2 (2x)
1.4 (2x) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4
preferred transport direction during soldering 2.8 4.5
sot023_fw
Fig 3.
Wave soldering footprint SOT23 (TO-236AB)
2PD602AXL_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 27 October 2008
6 of 9
NXP Semiconductors
2PD602AxL
50 V, 500 mA NPN general-purpose transistors
12. Revision history
Table 10. Revision history Release date 20081027 Data sheet status Product data sheet Change notice Supersedes Document ID 2PD602AXL_1
2PD602AXL_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 27 October 2008
7 of 9
NXP Semiconductors
2PD602AxL
50 V, 500 mA NPN general-purpose transistors
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
13.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
2PD602AXL_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 27 October 2008
8 of 9
NXP Semiconductors
2PD602AxL
50 V, 500 mA NPN general-purpose transistors
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Test information . . . . . . . . . . . . . . . . . . . . . . . . . Quality information . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 3 3 4 4 4 5 5 6 7 8 8 8 8 8 8 9
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 October 2008 Document identifier: 2PD602AXL_1

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